Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole
Patent
1995-12-21
1997-11-25
Powell, William
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating of groove or through hole
216 20, 216 36, B44C 122, C23F 100
Patent
active
056908377
ABSTRACT:
In a process for producing a multilayer printed circuit board comprising drilling holes for via holes in a composite film material containing at least a copper foil and an insulating half-cured adhesive layer, laminating the resulting film material on an innerlayer circuit substrate, ad electrically connecting an innerlayer circuit with an outer layer copper foil, when an adhesive resin flowed into the holes is roughened, or when a composite film material having a copper foil of less than 12 .mu.m thick formed on a carrier is used, or a special cushion material is further laminated on the laminate of the innerlayer circuit substrate and the film material, electrical connection reliability is enhanced and circuit density can be increased with easy steps.
REFERENCES:
patent: 4734156 (1988-03-01), Iwasa
patent: 5079065 (1992-01-01), Masakazu et al.
patent: 5517758 (1996-05-01), Nakamura
Patent Abstracts of Japan, vol. 14, No. 234 (E-0929), 17 May 1990.
Patent Abstracts of Japan, vol. 18, No. 22, (E-1490), 13 Jan. 1994.
Patent Abstracts of Japan, vol. 18, No. 661 (E-1644), 14 Dec. 1994.
Arike Shigeharu
Inada Teiichi
Kida Akinari
Nakaso Akishi
Ogino Haruo
Hitachi Chemical Company Ltd.
Powell William
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