Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1990-07-03
1993-05-11
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156668, 156901, 427307, H05K 300
Patent
active
052098192
ABSTRACT:
A molding capable of forming a precision fine-line circuit by the substractive method is produced by an improvement that a molding prepared by molding a liquid-crystal polyester resin composition comprising a melt-processable polyester (liquid-crystal polyester) capable of forming an anisotropic molten phase and an inorganic filler added thereto is etched and then treated to form a metallic coating on the surface thereof by sputtering, ion plating or vacuum deposition.
REFERENCES:
patent: 4101402 (1978-07-01), Vossen, Jr. et al.
patent: 4455207 (1984-06-01), Sartor et al.
patent: 4582564 (1986-04-01), Shanefield et al.
patent: 4615763 (1986-10-01), Gelorme et al.
patent: 4705592 (1987-11-01), Bahrle et al.
patent: 4714631 (1987-12-01), Aufderheide
patent: 4764327 (1988-08-01), Nozaki et al.
patent: 4795660 (1989-01-01), Cooray et al.
patent: 4816124 (1989-03-01), Manabe et al.
patent: 4826720 (1989-05-01), Wade
patent: 4943606 (1990-07-01), Inoue et al.
patent: 4950360 (1990-08-01), Murao et al.
patent: 4997724 (1991-03-01), Suzuki et al.
patent: 5059368 (1991-10-01), Allan et al.
Aketa Tomoyuki
Suzuki Yoshiharu
Dang Thi
Polyplastics Co. Ltd.
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