Process for producing metrological structures particularly usefu

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156626, 156651, 156657, 1566611, 156662, 156345, 437228, H01L 21306, B44C 122, C03C 1500, C23F 100

Patent

active

052465390

ABSTRACT:
Process for producing metrological structures particularly useful for analyzing the accuracy of instruments for measuring alignment on processed substrates. The process produces metrological structures which have measurement profiles defined on substrate regions and on industrially-processed regions on a single wafer. The measurement profiles define statistical distributions which can be detected by measurement machines in order to analyze the measurement accuracy of the machines themselves.

REFERENCES:
patent: 4650744 (1987-03-01), Amano
patent: 5002902 (1991-03-01), Watanabe
patent: 5017512 (1991-05-01), Takagi
patent: 5100508 (1992-03-01), Yoshida et al.
patent: 5114531 (1992-05-01), Fukushima et al.

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