Process for producing large-size substrate-based semiconductor m

Metal treatment – Process of modifying or maintaining internal physical... – Chemical-heat removing or burning of metal

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29572, 148 15, 148175, 156605, 156612, 156616R, 357 30, 357 59, 427 85, 427 86, 427113, H01L 21477, H01L 2184, H01L 3100

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041135326

ABSTRACT:
A process for producing large-size, substrate-based semiconductor material of silicon deposited on a substrate body from the gaseous phase, which comprises the steps of heating a substrate body by direct current passage to deposition temperature, contacting said body with a gaseous silicon-containing mixture to which a dopant has been added, until a deposit having a thickness from about 10 to 200 .mu.m has been formed, subsequently melting 80 to 100% of the deposited silicon layer from the free surface downward, and resolidifying the molten silicon by adjustment of a temperature gradient from the substrate body upward. Large-sized plates obtained by cutting up the semiconductor material are used as solar cells.

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