Process for producing high-density wiring board

Details Process for producing high-density wiring board Process for producing high-density wiring board

1987-03-31

1989-05-16

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29846, 29852, 156634, 156655, 1566591, 156668, 156150, 156233, 156901, 156902, 427 97, 430317, 430318, B44C 122, C03C 1500, C03C 2506, C23F 102

Patent

active

048306916

ABSTRACT:
A wiring board comprising (A) a base substrate on which the necessary wiring pattern has already been formed, and (B) a multi-layer substrate bonded to the wiring pattern side of said base substrate (A) and comprising heat-resistant resin layers and thin-film wiring patterns formed by a thin film forming method under vacuum can mount LSI chips on the substrate and realize increased density of signal wiring.

REFERENCES:
patent: 4180608 (1979-12-01), Del
patent: 4306925 (1981-12-01), Lebow et al.
patent: 4566186 (1986-01-01), Bauer et al.
patent: 4604160 (1986-08-01), Murakami et al.
patent: 4606787 (1986-08-01), Pelligrino
patent: 4668332 (1987-05-01), Ohnuki et al.

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