Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1989-01-04
1990-04-03
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29852, 156656, 1566591, 156666, 156902, 427 97, 427 98, C23F 100, B44C 122, C03C 1500, C03C 2506
Patent
active
049137689
ABSTRACT:
Conductor boards with well adhering conductor tracks are obtained if the substrates, which are clad on both sides with copper foils, have said cladding removed chemically or mechanically, are activated, if necessary sensitized, and are provided with a 0.05-2.0 .mu.m thick layer of nickel, cobalt, manganese, a nickel/iron or nickel/cobalt mixture in an electroless metallizing bath, a 0.5-5.0 .mu.m thick copper layer is applied in a subsequent copper bath and the conductor pattern is then built up by the standard semi-additive methods.
REFERENCES:
patent: 4260449 (1981-04-01), Berdan et al.
patent: 4285991 (1981-08-01), Gedrat et al.
patent: 4512829 (1985-04-01), Ohta et al.
patent: 4582564 (1986-04-01), Shanefield et al.
patent: 4820547 (1989-04-01), Linday et al.
Langer Friedrich
Merten Rudolf
Sirinyan Kirkor
VON Gizycki Ulrich
Wolf Gerhard D.
Bayer Aktiengesellschaft
Powell William A.
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