Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1986-08-01
1990-12-25
Simmons, David
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156902, 156630, 156666, 156901, 156233, 156245, 156246, 26427211, 26427217, 264132, H01L 21306
Patent
active
049800167
ABSTRACT:
A process for producing an electric circuit board comprises utilizing a transfer sheet, bearing an electric circuit pattern composed of a metal foil adhered onto a sheet substrate by means of an adhesive material, and transferring said electric circuit pattern onto a surface of an insulating resin substrate simultaneously with the molding thereof.
REFERENCES:
patent: Re29820 (1978-10-01), Konicek
patent: 2447541 (1948-08-01), Sabre et al.
patent: 2464157 (1949-03-01), Scheer
patent: 2585700 (1952-02-01), Strickman
patent: 3135823 (1964-06-01), Pritikin
patent: 3152938 (1964-10-01), Osifchin et al.
patent: 3734449 (1973-05-01), Itou et al.
patent: 3846168 (1974-11-01), Elmore
patent: 3889363 (1975-06-01), Davis
patent: 3990926 (1976-11-01), Konicek
patent: 4116753 (1978-09-01), Tojyo et al.
patent: 4264549 (1981-04-01), Utner
patent: 4367014 (1983-01-01), Howder
patent: 4606787 (1986-08-01), Pelligrino
patent: 4650545 (1987-03-01), Laakso et al.
patent: 4715116 (1987-12-01), Thorpe et al.
Maeoka Kunihiko
Tada Naoko
Canon Kabushiki Kaisha
Johnson Lori
Simmons David
LandOfFree
Process for producing electric circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for producing electric circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for producing electric circuit board will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1160724