Process for producing defect free multilayer printed circuit boa

Details Process for producing defect free multilayer printed circuit boa Process for producing defect free multilayer printed circuit boa

1992-11-12

1994-02-01

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428901, 428457, 1563069, 1563314, B32B 900

Patent

active

052831086

ABSTRACT:
A process for producing defect free multilayer printed circuit boards using low pressure lamination with a cyanate ester laminate. Alternate layers of cyanate ester core and prepreg materials are stacked and at least partially cured under pressure and elevated temperatures to produce a multilayer laminated printed circuit board. The use of a low pressure cure avoids the storage of stress within the laminate. Such stress would otherwise produce microcracking and/or delamination of the circuit board when the stress is released during the subsequent thermal cycling or exposure to caustics attendant with working and reworking of the printed circuit board.

REFERENCES:
patent: 4287014 (1981-09-01), Gaky
patent: 5132778 (1992-07-01), Juskey
Coombs, "Printed Circuits Handbook"; 3rd Ed., McGraw Hill, 1988 pp. 34.11-34.18.

Affiliated with

Also associated with

Rating

Process for producing defect free multilayer printed circuit boa does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for producing defect free multilayer printed circuit boa, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for producing defect free multilayer printed circuit boa will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-578739