Process for producing copper through-hole printed circuit board

Details Process for producing copper through-hole printed circuit board Process for producing copper through-hole printed circuit board

1985-10-07

1986-11-11

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156630, 156634, 1566591, 156902, 156904, 156666, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

046220976

ABSTRACT:
Disclosed is a process for producing a copper through-hole printed circuit board, which comprises forming a required pattern on a copper-clad laminated plate using a resist ink soluble in an alkaline aqueous solution, immersing the copper-clad laminated plate in an aqueous solution of a salt of an alkylimidazole compound represented by the following general formula ##STR1## wherein R.sub.2 represents an alkyl group having 5 to 21 carbon atoms, R.sub.4 represents a hydrogen atom or a methyl group, and HA represents an organic or inorganic acid, to form on the copper surface of the copper-clad laminated plate an etching resist film composed of the alkylimidazole compound, drying the resulting copper-clad laminated plate, and then treating it with an alkaline etching solution.

REFERENCES:
patent: 4389278 (1983-06-01), Kai
patent: 4529477 (1985-07-01), Lundberg et al.

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