Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1984-01-13
1985-08-06
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156652, 156656, 156657, 1566611, 204192E, 427131, 427132, 427259, B44C 122, C03C 1500, C03C 2506, C23F 102
Patent
active
045334315
ABSTRACT:
The invention relates to a process for producing conductors for integrated circuits using planar technology.
According to this process, on a substrate is deposited an insulating material coating. A masking sheet is deposited on the insulating material coating and this sheet is cut to form windows corresponding to the conductors to be obtained. The insulating material sheet is etched facing the windows. A conductive material is deposited on the cut masking sheet. The masking sheet and the conductive material covering it are removed. This process consists of choosing a masking sheet having a first coating covering the insulating material coating and a second masking coating covering the first coating. The first coating is cut chemically facing the windows and after cutting the second masking coating, the edges of the first coating on the periphery of the windows are eroded by chemical cutting.
Application to the production of planar integrated circuits.
REFERENCES:
patent: 4224361 (1980-09-01), Romankiw
patent: 4391849 (1983-07-01), Bischoff
Journal of the Electrochemical Society, vol. 125, No. 6, Jun. 1978, pp. 860-865, entitled Electrochemical Aspects of the Beveling of Sputtered Permalloy Films by J. J. Kelly and G. J. Koel.
Commissariat a l''Energie Atomique
Powell William A.
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