Process for producing and apparatus for improving the...

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step

Reexamination Certificate

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C257S677000

Reexamination Certificate

active

07732333

ABSTRACT:
A semiconductor having a leadframe is disclosed. In one embodiment, a leadframe is disclosed to be fitted with a semiconductor chip and is to be encapsulated with a plastic compound has a metallic single-piece base body, to which an interlayer is applied. The interlayer has a surface including a matrix of islands of remaining material of substantially uniform height, with voids extending between said islands.

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