Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate
2004-10-01
2010-06-08
Dickey, Thomas L (Department: 2893)
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
C257S677000
Reexamination Certificate
active
07732333
ABSTRACT:
A semiconductor having a leadframe is disclosed. In one embodiment, a leadframe is disclosed to be fitted with a semiconductor chip and is to be encapsulated with a plastic compound has a metallic single-piece base body, to which an interlayer is applied. The interlayer has a surface including a matrix of islands of remaining material of substantially uniform height, with voids extending between said islands.
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Betz Bernd
Dangelmaier Jochen
Paulus Stefan
Dicke Billig & Czaja, PLLC
Dickey Thomas L
Infineon - Technologies AG
Yushin Nikolay
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