Process for producing an assembly tape for bonding metal fingers

Details Process for producing an assembly tape for bonding metal fingers Process for producing an assembly tape for bonding metal fingers

1987-11-16

1988-10-18

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29827, 156634, 156645, 156651, 156656, 1566611, 156901, 430318, C23F 102, B44C 122

Patent

active

047785640

ABSTRACT:
In an assembly tape to be used in the tape automated bonding of semiconductor devices a single layer or two or three layer tape is described. The arrays of finger patterns created in the tape are isolated by forming transverse slots across the tape. These slots act to mechanically isolate adjacent finger patterns and improve tape flexibility. When the tape is passed under the guide shoe in an inner lead bonding machine the metal fingers will not be distorted as the tape flexes. After the semiconductor device is bonded to the tape the increased tape stiffness does not cause the tape to be deflected from its desired location with respect to the guide shoe. The slots desirably span the space between tape locator holes. If desired, the slots can be extended on the finger side of the tape to span the locator holes to form slot extension regions of reduced tape thickness. Alternatively, a slot can be formed from a plurality of shorter slots that in the aggregate perform the same function.

REFERENCES:
patent: 3611061 (1971-10-01), Segerson
patent: 3768986 (1973-10-01), Ramos et al.
patent: 4510017 (1985-04-01), Barber
patent: 4681654 (1987-07-01), Clementi et al.

Affiliated with

Also associated with

Rating

Process for producing an assembly tape for bonding metal fingers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for producing an assembly tape for bonding metal fingers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for producing an assembly tape for bonding metal fingers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1193406