Process for producing a semiconductor wafer

Details Process for producing a semiconductor wafer Process for producing a semiconductor wafer

1993-12-28

1994-12-20

Hearn, Brian E.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

437 61, 437228, 437225, 437974, 148DIG12, 148DIG135, 156633, 156643, B44C 122

Patent

active

053743296

ABSTRACT:
According to the present invention, there is provided semiconductor wafer, comprises a plurality of non-porous monocrystal layers laminated with interposition of an insulating layer or insulating layers on a substrate.

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