Process for producing a semiconductor laser mirror by ionic mach

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156647, 156648, 1566591, 156662, 437129, 437228, 437962, 20419234, H01L 21308, H01S 319

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active

048656844

ABSTRACT:
A semiconductor (10) is subject to ionic etching (14) through a mask, whereof one side determines the location of the mirror. This mask is constituted by a crystalline layer (12), whereof the side (16) is a crystallographic plane.

REFERENCES:
patent: 4248688 (1981-02-01), Gartner et al.
patent: 4354898 (1982-10-01), Coldren et al.
patent: 4397711 (1983-08-01), Donnelly et al.
patent: 4547956 (1985-10-01), Bouadma et al.
Coldren et al., "GaInAsP/InP Stripe-Geometry Laser with a Reactive Ion-Etched Facet", Applied Physics Letters, vol. 37, No. 8, pp. 581-583, 15 Oct. 1980.
Mikami et al., "CW Operation of 1.5 .mu.m GaInAsP/InP Buried-Heterostructure Laser . . . ", Electronic Letters, vol. 19, No. 6, pp. 213-215, Mar. 1983.
Demidov et al., "Bulk Waveguide Resonators for the Ultraviolet Part of the Spectrum", Soviet Journal of Quantum Electronics, vol. 13, No. 4, pp. 551-554, Apr. 1983.
Bouadma, "GaAs-GaAlAs DH Lasers with Ion Beam-Etched Facet", Second European Conference on Integrated Optics, Conference Pub. No. 227, pp. 24-26.

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