Process for producing a printed circuit board

Details Process for producing a printed circuit board Process for producing a printed circuit board

1989-04-10

1990-05-15

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29846, 156656, 1566591, 1566611, 156666, 156902, 204 23, 428209, 428601, 428901, 430318, B44C 122, C03C 1500, C23F 102, B29C 3700

Patent

active

049255258

ABSTRACT:
A method of making a printed circuit board includes providing a substrate coated with a conductive layer, developing a first photoresist layer on the conductive layer to define a first conductive pattern of the desired circuit configuration having a plurality of discontinuous segments, and a second conductive pattern interconnecting the discontinuous segments of the desired circuit configuration. A second layer of photoresist is positioned across the whole surface of the substrate except at least a selected portion of the first conductive pattern, and the substrate is electrically activated during a coating process for depositing conductive material on the selected portion of the first conductive pattern. The first conductive pattern is subsequently coated with photoresist, and the second conductive pattern, which is now exposed on the substrate, is subject to an etching process to effectively remove all of the second conductive pattern.

REFERENCES:
patent: 3075866 (1963-01-01), Baker et al.
patent: 3115423 (1963-12-01), Ashworth
patent: 3169063 (1965-02-01), Johnston et al.
patent: 4080513 (1978-06-01), Cuneo et al.

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