Process for preserving the surface of silicon wafers

Details Process for preserving the surface of silicon wafers Process for preserving the surface of silicon wafers

1989-06-20

1990-11-27

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

427299, H01L 21302, H01L 21463

Patent

active

049735632

ABSTRACT:
A process for preserving the surface of silicon wafers after the wafers are polished in a conventional polishing operation by converting the wafer surface to the hydrophobic state, in particular, by polishing, or with hydrofluoric acid and treating immediately afterwards with a reagent, e.g., alcohols, organosilanes or silanols and preferably in aqueous solution. The wafer becomes coated in this process with a protective layer which inhibits surface deterioration, and also permits long storage times.

REFERENCES:
patent: 3874129 (1975-04-01), Deckert et al.
patent: 3942982 (1976-03-01), Yanazawa et al.
patent: 4599243 (1986-07-01), Sachdev et al.
patent: 4608097 (1986-08-01), Weinberger et al.
patent: 4724171 (1988-03-01), Lampert et al.
patent: 4847159 (1989-07-01), Glajch et al.
patent: 4883775 (1989-11-01), Kobayashi

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