Process for preparing the printed-circuit boards using a photose

Details Process for preparing the printed-circuit boards using a photose Process for preparing the printed-circuit boards using a photose

1990-03-21

1990-10-23

Brammer, Jack P.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Readily visible image formation

430319, G03C 500

Patent

active

049650734

ABSTRACT:
Disclosed is an improved process for preparing the printed circuit board, which comprises coating a photo-curable electrodeposition coating composition on the surface of the copper foil of a copper-clad, laminated plate to form a photo-sensitive resist film thereon, lapping a photographic negative or positive film onto the photo-sensitive resist film, and exposing to an active light, followed by development, the improvement comprising incorporating a colorless or substantially colorless reduction-type leico pigment into the electrodeposition coating composition to form a photo-sensitive resist film containing the leico pigment, and to develop a color in an exposed area of the photo-sensitive resist film by exposing to the active light.

REFERENCES:
patent: 4425424 (1984-01-01), Altland et al.
patent: 4634655 (1987-01-01), Holman
patent: 4687728 (1987-08-01), Folkard et al.

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