Process for preparing superconductive wiring board

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156655, 156656, 1566591, 1566611, 156666, 20419224, 505816, 505820, 427 63, B44C 122, C03C 1500, C03C 2506, C23F 100

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049137697

ABSTRACT:
The present invention relates to an element comprising a superconductive material or a wiring formation technique. In a thin film wiring board in which a superconductive material is used as a conductor, annealing should be conducted at a high temperature in an oxygen atmosphere after formation of a film in order to convert the conductor portion into a superconductive material, which makes it necessary to use an inorganic oxide as the insulating film. This brought about a problem that the etching of the second and subsequent insulation layers causes a damage to the wiring and insulation layer provided thereunder.
In the present invention, an over-etching preventing layer is provided on a wiring layer provided under the second and subsequent insulation layers in order to solve the problem in question.
The present invention brings about an effect of realizing the formation of a multi-layered wiring layer by making use of a superconductive material.

REFERENCES:
patent: 4075756 (1978-02-01), Kircher et al.
patent: 4589961 (1986-05-01), Gershenson
Nikkei Electronics, published by Nikkei-McGraw-Hill Co., Jun. 17, 1985, pp. 243-266. (Japanese-No English Translation Available).
Japanese Journal of Applied Physics, vol. 26, No. 5, May 1987, pp. L709-L710. (English).
Japanese Journal of Applied Physics, vol. 26, No. 5, May 1987, pp. L738-L740. (English)

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