Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1988-08-04
1990-04-03
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156655, 156656, 1566591, 1566611, 156666, 20419224, 505816, 505820, 427 63, B44C 122, C03C 1500, C03C 2506, C23F 100
Patent
active
049137697
ABSTRACT:
The present invention relates to an element comprising a superconductive material or a wiring formation technique. In a thin film wiring board in which a superconductive material is used as a conductor, annealing should be conducted at a high temperature in an oxygen atmosphere after formation of a film in order to convert the conductor portion into a superconductive material, which makes it necessary to use an inorganic oxide as the insulating film. This brought about a problem that the etching of the second and subsequent insulation layers causes a damage to the wiring and insulation layer provided thereunder.
In the present invention, an over-etching preventing layer is provided on a wiring layer provided under the second and subsequent insulation layers in order to solve the problem in question.
The present invention brings about an effect of realizing the formation of a multi-layered wiring layer by making use of a superconductive material.
REFERENCES:
patent: 4075756 (1978-02-01), Kircher et al.
patent: 4589961 (1986-05-01), Gershenson
Nikkei Electronics, published by Nikkei-McGraw-Hill Co., Jun. 17, 1985, pp. 243-266. (Japanese-No English Translation Available).
Japanese Journal of Applied Physics, vol. 26, No. 5, May 1987, pp. L709-L710. (English).
Japanese Journal of Applied Physics, vol. 26, No. 5, May 1987, pp. L738-L740. (English)
Kanda Naoya
Okudaira Hiroaki
Sowa Takayoshi
Yamazaki Tetsuya
Hitachi , Ltd.
Powell William A.
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