Process for preparing printed circuit boards

Details Process for preparing printed circuit boards Process for preparing printed circuit boards

1987-04-29

1988-11-01

Lacey, David L.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156666, 156668, 156902, 427306, 427307, C23C 1800, C23F 100

Patent

active

047817887

ABSTRACT:
Boards coated with electroless plated copper to a thickness of less than 0.1 mil are achieved by stripping completely the copper from commercially available boards with copper cladding of about 0.7 mil thickness, treating the stripped board with a ceric sulphate solution and then electroless plating of the copper to the desired thickness in conventional manner.

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patent: 4639380 (1987-01-01), Amelio et al.

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