Process for preparing printed-circuit board

Details Process for preparing printed-circuit board Process for preparing printed-circuit board

1993-02-19

1994-03-15

McCamish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430318, 430327, 106 1405, 106 1416, 106 1418, 106 1437, 252390, 252394, G03F 726, C23F 1100

Patent

active

052945197

ABSTRACT:
A process for preparing a printed circuit board. The process involves successive steps of coating a photosensitive electrodeposition coating composition onto a printed-circuit copper-clad, laminated base plate to form a photosensitive resist film, applying a pattern mask onto the photosensitive resist film, exposing to an active light, developing and etching. Also the printed-circuit copper-clad, laminated base plate is subjected to a corrosion preventing treatment after cladding or laminating and prior to the step of coating the electrodeposition coating composition thereonto with a nitrogen-containing heterocyclic compound as a corrosion inhibitor.

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