Process for preparing confidential postcard

Details Process for preparing confidential postcard Process for preparing confidential postcard

1990-12-06

1991-12-24

Chin, Peter

Paper making and fiber liberation

Processes and products

Multi-layer waterlaid webs or sheets

162132, 162134, 162140, 162146, 162196, 229 928, 283100, 283101, 283111, 283116, 283901, D21F 1100

Patent

active

050749625

ABSTRACT:
A process for preparing a confidential postcard contains dehydrating a starting paper material containing 25 to 45% by weight of fibers of a thermoplastic resin and 55 to 75% by weight of fibers of a natural plant to thereby form a paper layer, heating, during or after drying, the paper layer at a temperature not lower than a softening point of the thermoplastic resin fibers to thereby obtain a paper sheet in which the fibers of the thermoplastic resin retain fiber shape and are entangled with the fibers of the natural plant, inscribing a statement to be kept confidential on the paper sheet, superposing the paper sheet to conceal the statement and attaching provisionally the superposed paper sheet by heating under pressure at a temperature not lower than a softening point of the thermoplastic resin fibers to obtain the confidential postcard. The confidential postcard is capable of being peeled off with the statement on the paper sheet being left intact.

REFERENCES:
patent: 3953642 (1976-04-01), Forbess et al.
patent: 4162180 (1979-07-01), Burton et al.
patent: 4742954 (1988-05-01), Shishido
patent: 4885198 (1989-12-01), Kimura
patent: 5005874 (1991-04-01), Matsuguchi et al.

Affiliated with

Also associated with

Rating

Process for preparing confidential postcard does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for preparing confidential postcard, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for preparing confidential postcard will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-41413