Process for preparing a multi-layer wiring board

Details Process for preparing a multi-layer wiring board Process for preparing a multi-layer wiring board

1994-09-30

1997-01-14

Fiorilla, Christopher A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

264 61, C04B 3700

Patent

active

055935265

ABSTRACT:
A process for producing a multi-layer wiring board having alternate layers of a glass ceramic material and conductor patterns. The glass ceramic layers are made up of a glass ceramic material including a glass matrix and ceramic particles dispersed in the matrix. The glass ceramic layers are caused to contain hollow or porous silica glass spheres dispersed in the glass ceramic material. The hollow or porous silica glass spheres are covered with a ceramic coating layer containing alumina as a constituent element. Such a structure prevents crystallization of the silica spheres and avoids the resultant rapid increase in the the thermal expansion coefficient of the glass ceramic layers. The structure provided by the process of the invention also precudes the formation of pores in the surfaces of the glass ceramic layers.

REFERENCES:
patent: 4518737 (1985-05-01), Traut
patent: 4781968 (1988-11-01), Kellerman

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