Process for preparing a combined wiring substrate

Details Process for preparing a combined wiring substrate Process for preparing a combined wiring substrate

1990-08-24

1991-12-03

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156633, 156643, 156655, 1562728, 1563041, 21912169, B44C 122, B29C 3700, B32B 3100, B23K 2600

Patent

active

050697455

ABSTRACT:
A process for preparing a combined wiring substrate is carried out by bonding with an adhesive agent the end surfaces of the mutually opposing sides of a plurality of substrates each having a pattern of wiring on its major surface, and by connecting electrically parts of the pattern of wiring which oppose each other by interposing the bonding portion.

REFERENCES:
patent: 4405971 (1983-09-01), Ohsawa
patent: 4526649 (1985-07-01), Gupta et al.
patent: 4772820 (1988-09-01), DiSanto et al.
patent: 4880679 (1989-11-01), Bonazza
patent: 4927493 (1990-05-01), Yamazaki et al.

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