Process for polishing silicon wafers

Details Process for polishing silicon wafers Process for polishing silicon wafers

1986-05-05

1987-09-08

Olzewski, Robert P.

Chemistry: electrical and wave energy

Processes and products

204 561, 51283R, 51323, 51326, B24B 100

Patent

active

046922237

ABSTRACT:
A process for polishing silicon wafers includes the step of carrying out last polishing step in the polishing operation in such a way that a protective film of silicon dioxide is produced on the surface of the polished wafer. The film does not interfere with e.g., the subsequent oxidation processes. The protective film protects the wafer surface from the many effects arising in subsequent processes which may unfavorably influence the quality of the surface.

REFERENCES:
patent: 2875384 (1959-02-01), Wallmark
patent: 3377258 (1968-04-01), Schmidt et al.
patent: 3429080 (1969-02-01), Lachapelle
patent: 3764491 (1973-10-01), Schwartz
patent: 4064660 (1977-12-01), Lampert
patent: 4070797 (1978-01-01), Griesshammer et al.
patent: 4092445 (1978-05-01), Tsuzuki et al.

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