Process for plasma etching

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156651, 156653, 156656, 156657, 1566591, 156665, 156345, 437228, 437238, 437245, H01K 21306, B44C 122, C03C 1500, C23F 100

Patent

active

052365492

ABSTRACT:
Plasma is produced continuously in an etching switching period for switching from a partial plasma etching process to the next partial plasma etching process to thereby proceed with anisotropic plasma etching even in the etching switching period. There is no period in which isotropic etching is performed throughout the process. The time period for executing the partial plasma etching process, which follows the etching switching period, is shortened while throughput is improved.

REFERENCES:
patent: 4528066 (1985-07-01), Merkling et al.
patent: 4915779 (1990-04-01), Srodes et al.
patent: 5013398 (1991-05-01), Long et al.
patent: 5017265 (1991-05-01), Park et al.
patent: 5035768 (1991-07-01), Mu et al.

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