Process for photoimaging a three dimensional printed circuit sub

Details Process for photoimaging a three dimensional printed circuit sub Process for photoimaging a three dimensional printed circuit sub

1987-11-16

1991-03-19

Bowers, Jr., Charles L.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430319, 430394, 430397, 355 40, 355 55, G03C 500

Patent

active

050010387

ABSTRACT:
Printed circuit patterns are photolithographically defined on a three dimensional "projection" surface (204) of a printed circuit substrate (202) using a projection image aligner and a photomask (210) having a planar image (210A). The geometry of the projection is restricted such that the slope of the projection surface, as measured at any point on the projection surface and relative to a reference plane which is parallel to the focal plane of the projection image aligner, is less than 90 degrees. A solution of photoresist includes a photoresist solvent, a fluorosurfactant and an aromatic hydrocarbon solvent, and is preferably sprayed over the projection surface. In one method of manufacture, the printed circuit substrate is moved from one position to another during the exposure of the photoresist layer (206). In another method, after a first portion of the projection surface is exposed by a first photomask (502), a second photomask (504) is substituted and the remainder of the projection surface exposed. In still another method, a photomask having a plurality of planar images (604A, 604B and 606A) each image being positioned parallel to the others but separated by a small distance, is used to simultaneously exposed the entire projection surface.

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patent: 4377339 (1983-03-01), Coppock
patent: 4764450 (1988-08-01), Ruckert et al.
patent: 4837129 (1989-06-01), Frisch et al.
patent: 4869999 (1989-12-01), Fukuda et al.
Paterson, "Automask: A Method to Image . . . 3-D Object", Motorola, TDB, vol. (1), No. 1, Aug. 1980.
Burk et al., "Comparing UV Exposure Systems . . . " National Electronics and Packaging Conf., Anaheim, Calif., Feb. 24-26, 1981.
"UV Exposure Systems", Circuits Manufacturing, vol. 18, No. 5, May 1978, pp. 45-48.

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