Coating processes – Coating by vapor – gas – or smoke – Metal coating
Patent
1996-04-29
1999-11-23
Beck, Shrive
Coating processes
Coating by vapor, gas, or smoke
Metal coating
4272552, 4272557, 2041921, 20419217, 438658, C23C 1606
Patent
active
059896337
ABSTRACT:
The present invention provides a process for depositing a planarized metal film on a dielectric surface having nonuniform conductor material deposits formed thereon. The planarized metal layer is formed using a warm physical vapor deposition process at a temperature greater than about 150.degree. C., preferably greater than about 250.degree. C. The nonuniform deposits of electrically conducting material are typically formed during selective chemical vapor deposition of a metal in high aspect ratio, subhalf micron apertures. The selective CVD deposition is directly followed by warm physical vapor deposition to obtain a planarized metal film. The metallization process is preferably carried out in an integrated processing system that includes both a PVD and CVD processing chamber so that once the substrate is introduced into a vacuum environment, the metallization of the apertures to form interconnects occurs without the formation of oxides between the layers.
REFERENCES:
patent: 5100501 (1992-03-01), Blumenthal et al.
patent: 5151305 (1992-09-01), Matsumoto et al.
patent: 5169803 (1992-12-01), Miyakawa
patent: 5171412 (1992-12-01), Talieh et al.
patent: 5514425 (1996-05-01), Ito et al.
Applied Materials Inc.
Beck Shrive
Meeks Timothy
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