Process for obtaining passive thin-layer circuits with resistive

Details Process for obtaining passive thin-layer circuits with resistive Process for obtaining passive thin-layer circuits with resistive

1990-12-11

1992-10-06

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 1566591, 296101, 29620, B05D 512, H01C 1706

Patent

active

051528690

ABSTRACT:
A process on a single insulating substrate for depositing in succession a thin layer of tantalium with high resistivity doped with nitrogen and oxygen, a less thin layer of titanium with low resistivity doped with nitrogen, a layer of palladium and a thick layer of gold. Selective chemical attacks of said layers then permit tracing of conducting lines, resistive lines with greater resistance and resistive lines with less resistance.

REFERENCES:
patent: 3423821 (1969-01-01), Nishimura
patent: 4112196 (1978-09-01), Selig et al.
patent: 4226932 (1980-10-01), Ferraris
patent: 4743953 (1988-05-01), Toyokura et al.
patent: 4801469 (1989-01-01), Norwood
European Search Report EP 87 20 1179.
Navy Technical Disclosure Bulletin, vol. 8, No. 4, Jun. 1983, pp. 83-86, Washington, US; H. Morris: "A Dual Resistivity Thin Film Hybrid Microcircuit".
Patent Abstracts of Japan, vol. 5, No. 34 (E-48) (706) 4th Mar. 1981; and JP-A-55 162 254 (Nippon Denki K.K.) Dec. 17, 1980.
Norwood, "A New Multiple Sheet Resistance Technology for Thin Film Circuits", Sandia National Lab., pp. 281-286.
Misiano et al., "Etch Sputtering for Realization of I.C. and M.I.C. with . . . Resistors", pp. 183-187.

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