Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1990-11-01
1992-04-21
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156633, 156634, 156656, 156667, 156902, 134 3, 252 792, 252 794, B44C 122, C23F 100
Patent
active
051064545
ABSTRACT:
Process for at least partially dissolving a copper oxide surface layer by contacting the surface layer with one or more copper oxide dissolving compounds. When used in the manufacture of a multilayer printed circuit board, the process improves adhesion between board layers, reduces or eliminates localized delamination of a multilayer board that occurs during through-hole drilling, and eliminates or substantially reduces the occurrence of pink ring.
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Allardyce George R.
Davies Anthony J.
Singh Amrik
Wayness David J.
Corless Peter F.
Goldberg Robert L.
Powell William A.
Shipley Company Inc.
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