Process for metal-plating ceramic surfaces

Details Process for metal-plating ceramic surfaces Process for metal-plating ceramic surfaces

1986-07-07

1989-03-14

Lacey, David L.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156635, 156662, 156663, 252 794, 252 795, B44C 122

Patent

active

048122025

ABSTRACT:
The present invention relates to a process for wet metal-plating of ceramic substrates. More particularly this invention relates to the wet chemical copper plating of Al.sub.2 O.sub.3 ceramics. It is essentially composed of a combined chemical pretreatment of the ceramic surface for chemical metallization without external electric current in such a manner that within only a single pretreatment step the substrate surface is chemically activated and is simultaneously covered with an adhesion promoter, and/or a sensitizer and/or an activator (catalyst).

REFERENCES:
patent: 3607473 (1971-09-01), Grunwald
patent: 3770528 (1973-11-01), Hermes
patent: 4428986 (1984-01-01), Schachameyer
patent: 4647477 (1987-03-01), DeLuca
patent: 4721549 (1988-01-01), Bogenschutz et al.

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