Process for manufacturing transparent conductive film wiring boa

Details Process for manufacturing transparent conductive film wiring boa Process for manufacturing transparent conductive film wiring boa

1993-04-27

1996-07-16

Derrington, James

Plastic and nonmetallic article shaping or treating: processes

Laser ablative shaping or piercing

264 81, 264430, 21912167, 427108, B23K 2600

Patent

active

055364667

ABSTRACT:
A process for manufacturing a transparent conductive film wiring board capable of being practiced according to a dry procedure to simplify the manufacturing and reduce the manufacturing costs. First, a SiO.sub.2 layer is provided on a substrate and then a black ITO film is formed on the SiO.sub.2 layer. The black ITO film is subject to processing using laser emitted from an output horn, resulting in being cut into a predetermined wiring pattern. Metal evaporated by laser processing is sucked by a vacuum suction head. Then, the substrate is subject to calcination to oxidize and crystallize the black ITO film 3 of the wiring pattern to form a transparent ITO film of the wiring pattern.

REFERENCES:
patent: 4081654 (1978-03-01), Mracek
patent: 4859496 (1989-08-01), Toyonaga
patent: 5160675 (1992-11-01), Iwamoto

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