Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Total dielectric isolation
Reexamination Certificate
2006-09-29
2009-12-15
Chen, Jack (Department: 2893)
Semiconductor device manufacturing: process
Formation of electrically isolated lateral semiconductive...
Total dielectric isolation
C438S423000, C438S528000, C257SE21563
Reexamination Certificate
active
07632735
ABSTRACT:
A process for manufacturing a silicon-on-insulator substrate comprising a single-crystal silicon substrate in which an oxide layer has been locally buried includes forming a step on the silicon substrate so that a region corresponding to the oxide layer has a greater surface height than other regions; then implanting oxygen ions in the silicon substrate so as to form the oxide layer.
REFERENCES:
patent: 2005/0202600 (2005-09-01), Yamashita
patent: 2004-193185 (2004-07-01), None
Chen Jack
Kolisch & Hartwell, P.C.
Sumco Corporation
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