Process for manufacturing semiconductor wafers having deformatio

Abrading – Abrading process – Glass or stone abrading

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437249, 451 55, 451 57, 451 63, B24B 100, H01L 21304

Patent

active

054005485

ABSTRACT:
A process for manufacturing semiconductor wafers having deformation ground in a defined way.

REFERENCES:
patent: 1401831 (1921-12-01), Taylor
patent: 2699633 (1955-01-01), Lapenas et al.
patent: 4896459 (1990-01-01), Brandt
patent: 4967461 (1990-11-01), Feldmeier
patent: 4991475 (1991-02-01), Malcok et al.
Landstein et al., "Forming a Crown Surface on the End of a Rod-Like Eleme, IBM TDB, vol. 20, No. 11A (Apr. 1978), p. 4332.

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