Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole
Reexamination Certificate
2005-11-29
2005-11-29
Norton, Nadine G. (Department: 1765)
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating of groove or through hole
C216S020000, C216S055000, C216S062000
Reexamination Certificate
active
06969471
ABSTRACT:
It comprises the steps of: a) arranging a dielectric substrate (1) with at least one conducting plate (2) joined by an adhesive (8) to at least one of its sides; b) removing areas of said plate (2) by selective chemical milling to provide conducting tracks (5) joined to the substrate (1) and separated by spaces between tracks (6); c) applying and hardening by radiation an electroinsulating filler material (7) to fill said spaces between tracks (6), covering the tracks (5); d) applying an abrasion treatment to obtain flush upper surfaces (3) of the filler material (7) and of the tracks; and e) cooling, after step c) and during step d), the printed circuit board to reduce the temperature of the filler material (7) to under its glass transition temperature.
REFERENCES:
patent: 5716663 (1998-02-01), Capote et al.
patent: 6163957 (2000-12-01), Jiang et al.
patent: 6272745 (2001-08-01), Kersten et al.
patent: 6370768 (2002-04-01), Itabashi
patent: 2002/0032961 (2002-03-01), Matsuda
patent: 2003/0077060 (2003-04-01), Chen et al.
Harang Bruce E
Lear Corporation
Norton Nadine G.
Tran Binh X.
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