Process for manufacturing printed circuit boards

Details Process for manufacturing printed circuit boards Process for manufacturing printed circuit boards

1977-08-03

1978-08-01

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156902, 174 685, 427 97, C23F 102

Patent

active

041041119

ABSTRACT:
Printed circuits are fabricated by a process which employs initial chemical deposition of copper on a predrilled substrate followed by electroplating build-up of conductors to desired pattern. The conductors are then passivated by thinly plating them with a mechanically durable, chemically passive metal. To provide solder compatibility in areas where connections are to be made to the printed circuits, a plating of tin/lead is applied in those areas while making all other areas to eliminate plating. The remaining exposed copper is then etched away. An insulating solder mask is then applied.

REFERENCES:
patent: 3772101 (1973-11-01), Chumbres et al.
patent: 3907621 (1975-09-01), Polichette et al.
patent: 4024631 (1977-05-01), Castillero

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