Process for manufacturing multilayer flexible wiring boards

Details Process for manufacturing multilayer flexible wiring boards Process for manufacturing multilayer flexible wiring boards

2006-01-31

2006-01-31

Edmondson, Lynne R. (Department: 1725)

Metal fusion bonding

Process

Using high frequency vibratory energy

Reexamination Certificate

active

06991148

ABSTRACT:
The multilayer flexible wiring board includes first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a bump connected to the surface of the second wiring layer. The resin film is adapted to form an opening when the bump is forced into the resin film and an ultrasonic wave is applied to the bump. The bump is left in the opening to electrically connect the top of the bump to the first wiring layer.

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