Process for manufacturing metal plane support for multi-layer le

Details Process for manufacturing metal plane support for multi-layer le Process for manufacturing metal plane support for multi-layer le

1996-10-01

1998-12-29

Graybill, David

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438113, 438118, 438123, H01L 2148, H01L 2171

Patent

active

058540946

ABSTRACT:
A process for manufacturing a metal plane support for making multi-layer lead frames adapted to be used for semiconductor devices. The lead frame support is made of a single thin metal strip having a plurality of lead frames continuously arranged in the longitudinal direction, the metal plane support is also made of a single thin metal strip and includes a plurality of metal planes, such as power supply planes, ground planes of the like, continuously arranged in the longitudinal direction corresponding to said plurality of lead frames. A pair of side rails are extending in the longitudinal direction for supporting the metal planes therebetween. The metal planes are connected to the rails via separating portions for removing the rails from the metal planes, after the metal planes are adhered to the corresponding lead frames.

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