Process for manufacturing leadless semiconductor packages...

Details Process for manufacturing leadless semiconductor packages... Process for manufacturing leadless semiconductor packages...

2006-10-24

2006-10-24

Zarneke, David A. (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S015000, C438S123000, C257SE21521, C257SE21510

Reexamination Certificate

active

07125747

ABSTRACT:
A process for manufacturing a plurality of leadless semiconductor packages includes an electrically testing step to test encapsulated chips in a matrix of a leadless leadframe. Firstly, a leadless leadframe having at least a packaging matrix is provided. The packaging matrix defines a plurality of units and a plurality of cutting streets between the units. The leadless leadframe has a plurality of leads in the units and a plurality of connecting bars connecting the leads along the cutting streets. A plated metal layer is formed on the upper surfaces of the leads and the upper surfaces of the connecting bars. After die-attaching, wire-bonding connection, and encapsulation, the leadless leadframe is etched to remove the connecting bars, then two sawing steps are performed. During the first sawing step, the plated metal layer on the upper surface of the connecting bars is cut out to electrically isolate the leads. Therefore, a plurality of chips sealed by an encapsulant on the packaging matrix can be electrically tested by probing which is performed between the first sawing and the second sawing. Thereafter, the encapsulant is cut to form a plurality of individual package bodies of the leadless semiconductor packages during the second sawing.

REFERENCES:
patent: 6281047 (2001-08-01), Wu et al.
patent: 6489218 (2002-12-01), Kim et al.
patent: 6773961 (2004-08-01), Lee et al.
patent: 6800508 (2004-10-01), Kimura
patent: 6872599 (2005-03-01), Li et al.

Affiliated with

Also associated with

Rating

Process for manufacturing leadless semiconductor packages... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for manufacturing leadless semiconductor packages..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for manufacturing leadless semiconductor packages... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3651674