Process for manufacturing electronic circuits

Details Process for manufacturing electronic circuits Process for manufacturing electronic circuits

1996-05-15

1999-08-17

Picardat, Kevin M.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438613, H01L 2144

Patent

active

059407280

ABSTRACT:
A process for manufacturing electronic circuits, according to which soldering can be carried out without using flux by applying a metal surface treatment procedure which allows oxide film, organic matters, carbon or the like on the surface of metal to be easily removed without using a complex process nor unfavorably affecting electronic devices or circuit substrates. A process of connecting an electronic device and a circuit substrate by means of solder comprises the steps of irradiating the solder with a laser beam to clean the solder, aligning and mounting the electronic device on the circuit substrate, and hot-melting said solder in a low-oxygen content atmosphere to bond the electronic device and the circuit substrate.

REFERENCES:
patent: 5232674 (1993-08-01), Mukai et al.
patent: 5451274 (1995-09-01), Gupta
patent: 5499668 (1996-03-01), Katayama et al.

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