Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1983-04-15
1985-07-09
Bernstein, Hiram H.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156607, 156617SP, 156DIG70, C30B 1504
Patent
active
045280614
ABSTRACT:
A process for manufacturing boron-doped GaAs single crystals which comprises preparing a mixture of boron, gallium and arsenic covered by a liquid B.sub.2 O.sub.3 encapsulant, melting the mixture, pulling up boron-doped GaAs crystals from the mixture melts in accordance with the LEC method, crushing those crystals into small pieces after removing the seed end therefrom, remelting those pieces in the presence of B.sub.2 O.sub.3, and pulling up single crystals from the mixture melts in accordance with the LEC method.
REFERENCES:
patent: 4200621 (1980-04-01), Liaw et al.
patent: 4303464 (1981-12-01), Suzuki et al.
AuCoin et al.; Liquid Encapsulated Compounding and Czochralski Growth of Semi-Insulating GaAs; Solid State Tech.; Jan. '79, pp. 59-62 & 67.
Kawasaki Akihisa
Kotani Toshihiro
Miyazawa Shintaro
Nanishi Yasushi
Tada Kohji
Bernstein Hiram H.
Gzybowski Michael S.
Nippon Telegraph & Telephone Public Corporation
Sumitomo Electric Industries Ltd.
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