Process for manufacturing ball grid array package

Details Process for manufacturing ball grid array package Process for manufacturing ball grid array package

2005-12-27

2005-12-27

Blum, David S. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S122000

Reexamination Certificate

active

06979594

ABSTRACT:
A ball grid array package is manufactured by mounting a semiconductor die to a first surface of a substrate array. Wires are bonded between the semiconductor die and ones of conductive traces of the substrate array. The heat spreader is disposed in a mold and the substrate array is releasably clamped to a top die of the mold. The semiconductor die, the substrate array, the wire bonds and the heat spreader are molded into a molding material to provide a molded package. Next, the molded package is removed from the mold and a plurality of solder balls are added in the form of a ball grid array on a second surface of the substrate array such that bumps of the ball grid array are electrically connected to the conductive traces. The integrated circuit package is then singulated from a remainder of the substrate array.

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U.S. Appl. No. 10/647,696, Mohan Kirloskar et al., “Improved Ball Grid Array Package And Process for Manufacturing Same”, filing date: Aug. 25, 2003.
U.S. Appl. No. 10/643,961, Chun Ho Fan et al., “Improved Ball Grid Array Package and Process for Manufacturing Same”, filing date: Aug. 20, 2003.
U.S. Appl. No. 10/372,421, Joseph Andrew Martin et al., “Improved Ball Grid Array Package”, filing date: Feb. 24, 2003.
U.S. Appl. No. 10/197,832, Joseph Andrew Martin et al., “Improved Ball Grid Array Package”, filing date, Jul. 19, 2002.
U.S. Appl. No. 10/323,657, Chun Ho Fan et al., “Process for Manufacturing Ball Grid Array Package,” filing date: Dec. 20, 2002.

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