Process for manufacturing a semiconductor device having a steppe

Details Process for manufacturing a semiconductor device having a steppe Process for manufacturing a semiconductor device having a steppe

1997-01-27

1998-04-07

Graybill, David

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

438123, 438124, H01L 2156, H01L 2158, H01L 2160, H01L 2166

Patent

active

057364281

ABSTRACT:
A process for manufacturing semiconductor device including a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.

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