4. Semiconductor device manufacturing: process
  5. With measuring or testing
  6. Packaging or treatment of packaged semiconductor

Takashi Mashiko

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Camera enabling recycling of parts retrieved from a lens fitted

Photography – Disposable or recyclable camera
Patent

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Film feed device of camera

Photography – With film drive – Mechanical detail
Patent

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Film loading apparatus using planet gear

Patent

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Method of bonding metal plates, apparatus therefor and hot strip

Metal fusion bonding – With means to cut or separate work – filler – flux – or product
Patent

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Method of bonding metal plates, apparatus therefor and hot...

Metal fusion bonding – Process – With shaping
Reexamination Certificate

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Profile ID: LFUS-PAI-P-34798

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