Process for manufacturing a semiconductor device

Details Process for manufacturing a semiconductor device Process for manufacturing a semiconductor device

1998-11-16

2000-07-04

Wilczewski, Mary

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438656, 438685, 438688, 438785, 438973, 438648, 257915, 257763, 257764, 257767, H01L 21768, H01L 213205

Patent

active

060838302

ABSTRACT:
A process for producing a semiconductor device comprising the steps of forming a titanium film having a (002) orientation, forming a titanium nitride film on the titanium film to such a thickness as allows the titanium nitride film to follow the orientation of the titanium film, and forming an aluminum alloy film on the titanium nitride film, thereby to form a layer structure for wiring including the aluminum alloy film having a (111) orientation.

REFERENCES:
patent: 5523259 (1996-06-01), Merchant et al.
patent: 5580823 (1996-12-01), Hegde et al.
patent: 5627102 (1997-05-01), Shinriki et al.
patent: 5652464 (1997-07-01), Liao et al.
patent: 5776831 (1998-07-01), Padmanabhan et al.

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