Process for manufacturing a printed circuit board using a mask w

Details Process for manufacturing a printed circuit board using a mask w Process for manufacturing a printed circuit board using a mask w

1997-11-12

1999-07-27

Duda, Kathleen

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430313, 430330, 430396, G03F 720

Patent

active

059288388

ABSTRACT:
A method of exposing a photoresist layer deposited on a substrate uses an exposure mask having transparent and opaque regions defined on a mask substrate and a transition region defined on said mask substrate between said transparent region and said opaque region. The transition region comprises a plurality of opaque patterns having respective sizes and disposed with respective mutual separations such that said transmission region has a gradually increasing transmittance proceeding from said opaque region to said transparent region. The exposed photoresist layer is developed to form a resist pattern and the resist pattern is converted into an insulation pattern by conducting a baking process.

REFERENCES:
patent: 5487962 (1996-01-01), Rolfson
patent: 5508133 (1996-04-01), Bae
patent: 5523184 (1996-06-01), Hwang et al.
patent: 5585210 (1996-12-01), Lee et al.
patent: 5667918 (1997-09-01), Brainerd et al.
patent: 5821013 (1998-10-01), Miller et al.

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