Process for manufacturing a multi-layer lead frame having a grou

Details Process for manufacturing a multi-layer lead frame having a grou Process for manufacturing a multi-layer lead frame having a grou

1991-05-16

1994-01-25

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437208, 437220, H01L 2158, H01L 2160

Patent

active

052815560

ABSTRACT:
A process for manufacturing a multi-layer semiconductor lead frame comprising the step of adhering a lead frame strip to a metal power supply plane strip and a metal ground plane strip.

REFERENCES:
patent: 3526568 (1969-06-01), Kepple et al.
patent: 4835120 (1989-05-01), Mallik et al.
patent: 4957882 (1990-09-01), Shinomiya
patent: 5023202 (1991-06-01), Long et al.
patent: 5043227 (1991-08-01), Perry et al.
Proceedings of the 1989 Japan International Electronic Manufacturing Technology Symposium, Apr. 26, 1989, Nara, Japan, pp. 221-229, D. Mallik et al., "Multi-layer Molded Package", p. 221, paragraph Package Design, FIG. 3.

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