Process for manufacturing a lead-on-chip semiconductor device pa

Details Process for manufacturing a lead-on-chip semiconductor device pa Process for manufacturing a lead-on-chip semiconductor device pa

1997-05-09

1999-07-13

Graybill, David

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438123, 438124, H01L 2156, H01L 2158, H01L 2160

Patent

active

059239573

ABSTRACT:
A lead-on-chip semiconductor device package is formed by attaching a lead frame to the chip with a discontinuous adhesive layer. Electrode pads of the chip are electrically connected by bonding wires and mechanically connected by the adhesive layer to the lead frame, and then encapsulated by an encapsulant such as molding compound. The adhesive layer is formed from a liquid adhesive material having a certain viscosity. Although the liquid adhesive is continuously applied to top surfaces of the inner leads as well as gaps between adjacent inner leads, the adhesive layer is formed only on the top surfaces of the inner leads while the liquid adhesive falls through the gaps. Thermoplastic or thermosetting resins may be used as the liquid adhesive.

REFERENCES:
patent: 5086018 (1992-02-01), Conru et al.
patent: 5286679 (1994-02-01), Farnworth et al.
patent: 5358904 (1994-10-01), Murakami et al.
patent: 5714405 (1998-02-01), Tsubosaki et al.

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