Process for manufacturing a lead frame

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Treating substrate prior to coating

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205658, 205682, 205683, 205263, 205265, 427328, C25D 534, B05D 300

Patent

active

056607083

ABSTRACT:
It is an object of this invention to provide a process for manufacturing a lead frame by polishing a blank for a lead frame electrolytically and plating the electrolytically polished surface of the blank with a metal, which process enables the electrolytic polishing of the blank to be continued for a long time by employing a contactless electrolytic polishing apparatus, and can form an electrolytically polished surface which is sufficiently smooth to allow it to be plated with a very good metal coating.
The contactless electrolytic polishing apparatus is employed for applying a direct current with ripples having a frequency of 40 to 120 Hz alternately to the anode and cathode in an electrolytic polishing tank filled with an electrolytic polishing solution, so that the time for which the blank positioned between both electrodes functions as the anode may be at least 3.3 times longer than that for which it functions as the cathode, and the blank is, then, plated with a metal by employing a customary method.

REFERENCES:
patent: 2582020 (1952-01-01), Emery
patent: 3630864 (1971-12-01), Nakamura et al.
patent: 4125444 (1978-11-01), Inoue
patent: 4545875 (1985-10-01), Riley
patent: 4548683 (1985-10-01), Huang et al.
patent: 5242556 (1993-09-01), Masuzawa

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