Process for manufacturing a flip-chip integrated circuit

Details Process for manufacturing a flip-chip integrated circuit Process for manufacturing a flip-chip integrated circuit

1996-05-21

1999-05-25

Graybill, David

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438615, 22818022, H01L 21283, H01L 2160

Patent

active

059077867

ABSTRACT:
A method of producing a packaged semiconductor integrated circuit including hardened resin packaging and a polished electrode including producing external electrodes on a wafer including an IC chip employing photolithography in a process for producing an IC chip; depositing and hardening resin on the wafer; polishing the wafer to clean the external electrodes; and cutting the wafer and separating the resulting chips from the wafer, thereby producing a flip-chip package.

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patent: 3798754 (1974-03-01), Price et al.
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patent: 4742023 (1988-05-01), Hasegawa
patent: 5258648 (1993-11-01), Lin
patent: 5289337 (1994-02-01), Aghazadeh et al.
patent: 5334422 (1994-08-01), Myers et al.
Microelectronics Packaging Handbook; New York, Van Nostrand Reinhold, pp. 380, 828-829 and 833-834. TK7874.T824, 1988.

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