Process for manufacture of printed circuit boards by etching

Details Process for manufacture of printed circuit boards by etching Process for manufacture of printed circuit boards by etching

1992-02-07

1993-09-28

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 156666, 156902, C23F 100, B44C 122

Patent

active

052483827

ABSTRACT:
In the manufacture of printed circuits according a the present state of the art, employing ammonia solutions for removing metallic copper from printed circuit boards, the common practice is to use the solutions until saturated with copper, and then replacing them with new solutions. In the process of the invention, the solutions are used continuously, including in the process a decanter or other way of separating solids from liquids, like filtration, centrifugation, and the like, removing the separated solids from the process (for posterior neutralization), and adding to the process a regenerating solution and/or aqueous ammonia and/or gaseous ammonia.

REFERENCES:
patent: 3772105 (1973-11-01), Shipley
patent: 4428773 (1984-01-01), Krotz
patent: 4915776 (1990-04-01), Lee

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